The advances in metallic nanoparticles printing have enabled printing of electronics on substrates which are cheaper, lighter, thinner, environment friendly and suitable for flexible and conformal gadgets.​
All integrated circuits (IC) have to be packaged. Typically these packages are mere holders of the IC. These ICs are then mounted on system boards that contain lots of components, like passives, interconnections, power sources, etc. The system on package (SoP), is a new approach that brings in functionality into the package by realizing passive components inside the package.
Low-Temperature Co-fired Ceramic (LTCC) is a mature medium for SoP applications. Efficient passive elements can be designed in LTCC because of its low losses. The introduction of a high-dielectric constant ferrite material in the package not only helps to miniaturize the components but also permits the control of the devices made from it.