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Integrated Microwaves Packaging Antennas & Circuits Technology

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MIT Logo
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Massachusetts Institute of Technology: MIT

​Department of Chemical Engineering​

Prof. Michael Strano​​

https://cheme.mit.edu/

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University of Colorado Boulder

​Department of Electrical, Computer & Energy Engineering​

Prof. Garret Moddel​​

https://www.colorado.edu/ecee/

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University of California, Los Angeles

​Electrical and Computer Engineering Department​

Prof. Mona Jarrahi​​

http://www.ee.ucla.edu/

 

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Poly-Grames - Polytechnique Montréal

Department of Electrical Engineering

Prof. Ke Wu​​​

Prof. Mohammad S. Sharawi​

http://www.polymtl.ca/en

 

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National University of Singapore

​Department of Electrical and Computer Engineering​

Prof. Kuo Yong Xin​​

http://www.nus.edu.sg/

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University of Ontario Institute of Technology

Langis Roy​
http://www.ontariotechu.ca/

 

VTT Technical Research Center of Finland
VTT Technical Research Center of Finland

 

Technical Research Center of Finland, VTT

Technical Research Center of Finland, VTT
Markku Lathi
Kari Kautio
http://www.vtt.fi/research/mel/

 

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Georgia Institute of Technology

​School of Electrical and Computer Engineering
Manos Tenetzeris
http://www.ece.gatech.edu
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University of California Berkeley

​Organic Electronics Group
Vivek Subramanian
http://eecs.berkeley.edu/
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Wireless System Design & Packaging IBM

​Thomas J. Watson Research Center
Duixian Liu
http://www.ibm.com/
King Saud University Logo
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King Saud University

​Saleh A. Alshebeili​

https://ksu.edu.sa/en/

 
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American University in Cairo (AUC)

​School of Sciences and Engineering, Physics Department
Sherif Sedky
Ezzeldin Soliman
http://www.aucegypt.edu/

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