Research

Our lab works on Silicon Photonics with special emphasis on integration of on-chip light sources. Leveraging the state of the art nanofabrication technology and interdisciplinary cooperation, we develop photonic integrated circuits that can be applied for data communications, biosensors/bioimaging, energy harvesting, machine vision, and quantum information processing.

Please check our recent review paper discussing the prospects of QD Lasers and Integration with Si PIC

Our invited talk at PIERS 2022 and CLEO 2022  reviewed recent stride that has been made in individuals QD devices grown on Si, and several paths to be explored for active-passive coupling and co-Integration of QD lasers to the rest parts of Si photonics. 

 

 

ACS
Monolithic integration with QD active medium

Direct epitaxial integration of III-V optoelectronic devices on Si offers a substantial manufacturing cost and scalability advantage over heterogeneous integration via wafer bonding.

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Heterogeneously Integration

Heterogeneous integration bonds unpatterned III-V thin films to silicon wafers at the early- to mid-stages with a coarse alignment, and then define devices lithographically on the full wafer scale.

PICs in different system-level applications with integrated on-chip lasers via different integration techniques.
System-level applications with integrated on-chip lasers

From the system-level, we develop photonic integrated circuits with on-chip lasers for applications of optical communications and interconnects, optical phased array-based LiDAR, sensors for chemical and biological analysis, integrated qu

device level
Device level in integrating on-chip lasers

From the device-level, different routes taken in integrating on-chip lasers will be explored from different material systems to the chosen integration methodologies: monolithic integration and heterogeneous integration

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Microcavity devices

By light confinement in small volumes with resonant recirculation, microcavity lasers promise to complement the rise of Si photonics by populating these chips with sma