Rolling out an e-sticker revolution
High-speed fabrication developed at KAUST can turn out adhesive and flexible electronic devices in any shape imaginable.
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The healthcare industry forecasts that our wellbeing in the future will be monitored by wearable wirelessly networked sensors. Manufacturing such devices could become much easier with decal electronics. A KAUST-developed process prints these high-performance silicon-based computers on to soft, sticker-like surfaces that can be attached anywhere.
Fitting electronics on to the asymmetric contours of human bodies demands a re-think of traditional computer fabrications. One approach is to print circuit patterns on to materials such as polymers or cellulose using liquid ink made from conductive molecules. This technique enables high-speed roll-to-roll assembly of devices and packaging at low costs.
Flexible printed circuits, however, require conventional silicon components to handle applications such as digitizing analog signals. Such rigid modules can create uncomfortable hot spots on the body and increase device weight.
For the past four years, Muhammad Hussain and his team from the KAUST Computer, Electrical and Mathematical Science and Engineering Division have investigated ways to improve the flexibility of silicon materials while retaining their performance.
“We are trying to integrate all device components—sensors, data management electronics, battery, antenna—into a completely compliant system,” explained Hussain. “However, packaging these discrete modules on to soft substrates is extremely difficult.”
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