Current and Future Challenges and Solutions in AI & HPC System and Thermal Management

-

B4 L5 R5209

Led by expert Dr. Gamal Refai Ahmed, this course explores innovative thermal management and packaging solutions for AI and HPC systems, addressing current and future challenges with cutting-edge techniques and next-generation design principles.

In the rapidly evolving fields of Artificial Intelligence (AI) and High-Performance Computing (HPC), thermal management and packaging play critical roles in system reliability and performance. This course, led by Dr. Gamal Refai Ahmed, Ph.D., FIEEE, LFASEM, Fellow Canadian Academy of Engineering, Fellow Engineering Institute of Canada, AE, and member of the National Academy of Engineering, addresses the current and future challenges in these areas, presenting innovative, state-of-the-art thermo-mechanical solutions backed by patents and publications. Dr. Refai-Ahmed, renowned for his groundbreaking work in thermal management, silicon and power architecture, and advanced packaging technologies, will share insights based on his latest IEEE publications (2020-2024), exploring the Heterogeneous Integration Roadmap (HIR) and Advanced Packaging Technologies (MAPT) by SRC. The course will introduce the Seven Principles defining the next generation of thermal management architecture, with practical examples demonstrating the architecture of decoupling mechanical tolerances and coupling thermal management from a system level. Detailed discussions will cover first-line and second-line cooling solutions, direct liquid cooling, immersion cooling, and microfluidic approaches, addressing manufacturing, assembly, and reliability limitations from both package and system perspectives. Techniques to enable thermal loads beyond 1 kW will also be explored. Attendees, including thermal, mechanical, reliability, and assembly engineers, will engage in interactive discussions and gain practical, hands-on experiences that can be applied to their daily engineering practices. This course promises to be highly interactive and practical, drawing on industrial developments from first principles of engineering and showcasing advanced thermal-mechanical solutions. Join us to explore the forefront of AI and HPC system thermal management and gain knowledge that will propel your career forward.

Key Takeaways:

  • A comprehensive understanding of the current and future challenges in thermal management and packaging.
  • Exposure to innovative solutions and cutting-edge technologies.
  • Practical insights that enhance daily engineering practices and drive industry advancements.
  • This course promises to be highly interactive and practical, drawing on industrial developments from first principles of engineering and showcasing advanced thermal-mechanical solutions. Join us to explore the forefront of AI and HPC system thermal management and gain knowledge that will propel your career forward.

Presenters

Dr. Gamal Refai-Ahmed, Senior Fellow & Chief Architect, AMD Member of U.S. National Academy of Engineering Life Fellow, Canadian Academy of Engineering Fellow, Engineering Institute of Canada Fellow & Distinguished Lecturer, IEEE Life Fellow, ASME

Brief Biography

Dr. Gamal Refai-Ahmed is a world-renowned technical executive whose contributions to thermal management, advanced packaging technologies, and high-performance computing have significantly shaped industries including telecommunications, automotive, AI, and HPC. His pioneering work has established him as a leader in 3D heterogeneous integration, silicon and power architecture, and innovative cooling technologies, driving next-generation advancements in data centers and AI-enabled systems.

Dr. Refai-Ahmed’s professional achievements are marked by numerous accolades, including election to the National Academy of Engineering (NAE) in 2024 and receipt of the Distinguished Alumni Medal for Professional Achievement from the University of Waterloo. He is a Xilinx Fellow, a title recognizing the pinnacle of technical leadership, and an IEEE Fellow, highlighting his exceptional contributions to engineering and technology. Other honors include the prestigious Presidential Medal for Innovation Leadership from Binghamton University, the IEEE Canada R.H. Tanner Industrial Leadership Silver Medal, and ASME’s Calvin Lecture Award for advancing engineering best practices globally. He is also a recipient of the Mahboob Khan Award from SRC and the Excellence in Thermal Management Award from ASME, cementing his legacy as a transformational innovator.

Dr. Refai-Ahmed holds over 150 international patents and has authored more than 120 peer-reviewed publications, demonstrating his prolific contributions to thermal modeling, advanced cooling systems, and heterogeneous integration. His roles in professional societies include Associate Editor for the IEEE Transactions on Components, Packaging, and Manufacturing Technology and the ASME Journal of Electronic Packaging. He has held leadership positions such as Chair of ASME’s Electronics and Photonics Packaging Division, Vice Chair of the IEEE EPS Emerging Technology Committee, and a member of the IEEE Fellow Committee.

In industry, Dr. Refai-Ahmed has held influential roles at Nortel, ATI Technologies, AMD, and Xilinx, spearheading transformative technologies such as vapor chamber cooling, TSV, and lidless FPGA designs. His work as a Senior Technology Architect at GE Global Research Center and his advisory roles with key organizations like the Semiconductor Research Corporation highlight his impact on shaping future technological directions.
Academically, Dr. Refai-Ahmed serves as an Adjunct Professor at both the University of Toronto and SUNY Binghamton, fostering collaboration between academia and industry. He holds a B.Sc. and M.Sc. in Mechanical Engineering from Alexandria University and a M.A.Sc. and Ph.D. from the University of Waterloo, specializing in heat transfer and thermal management for electronics.

A Fellow of the Canadian Academy of Engineering and a Life Fellow of ASME, Dr. Refai-Ahmed continues to push the boundaries of engineering innovation, blending technical excellence with visionary leadership to shape the future of AI, HPC, and electronics packaging.