Thursday, July 09, 2020, 15:00
In this thesis, we present a pragmatic heterogeneous integration strategy to obtain high-performance 3D electronic systems using existing CMOS technology. Critical challenges addressed during the process are; reliable flexible interconnects, maximum area efficiency, soft-polymeric packaging, and heterogeneous integration compatible with current CMOS technology. First, a modular LEGO approach presents a novel method to obtain flexible electronics in a lock-and-key (plug and play) manner with reliable interconnects. It includes a process to convert standard rigid IC into flexible LEGO without any performance degradation with a high-yield. For the majority of healthcare and environmental monitoring applications, a sensory array is essential for continuous spatiotemporal activity recording. Here we present an ultra- high-density sensory solution (1 million sensors) as an epitome of density and address each of the associated challenges. A generic heterogeneous integration scheme is devised to obtain a physically flexible standalone electronic system using 3D-coin architecture. Lastly, a feather-light non-invasive ‘Marine-Skin’ platform to monitor deep-ocean monitoring is presented using the heterogeneous integration scheme. Electrical and mechanical characterization establish the reliability, integrity, robustness, and ruggedness of the processes, sensors, and multisensory flexible system.