Adaptive Unbound Resilient Electronics for Organic and Reconfigurable Architectures Realizing Fully Flexible 3D-IC Systems for Extreme, Evolving, and Embedded Environments

Overview

The fusion of 3D integrated circuit (3D-IC) architectures with fully flexible, reconfigurable platforms marks a transformative inflection point in the evolution of electronics. In this talk, we introduce AURORA—Adaptive Unbound Resilient Electronics for Organic and Reconfigurable Architectures—a forward-looking vision where electronic systems transcend rigid boundaries to become conformal, autonomous, sustainable, and embedded in their environments.

We showcase a suite of recent advances across flexible electronics, dissolvable packaging, liquid metal-enabled systems, NFC-powered devices, wearable sensors, and swarm-capable microsystems. At the heart of this progress lies the breakthrough realization of flexible 3D-IC systems, marrying high-density functionality with mechanical softness, enabling electronics to operate in extreme environmental and physiological conditions—on skin, in organs, under water, in outer space, and beyond.

This paradigm integrates heterogeneous chiplets, soft substrates, advanced thermal management, and adaptive communication into a seamless architecture—delivering intelligent, miniaturized, and environmentally aware systems. We will explore implications across healthcare, robotics, neuroscience, public health surveillance, and green manufacturing.

AURORA is not merely an acronym; it is the dawn of a new electronics era—where systems are not only smarter and smaller, but resilient, regenerative, and responsive to the world they serve.