About Zhanibek Bizak Zhanibek Bizak Ph.D. Student, Electrical and Computer Engineering Radio Frequency Integrated Circuit Zhanibek Bizak is a Ph.D. student in the Electrical Engineering department at Integrated Microwaves Packaging Antennas & Circuit Technology (IMPACT) Research Group under the supervision of Professor Atif Shamim at King Abdullah University of Science and Technology (KAUST). Education and Early Career Zhanibek Bizak received his B.S. degrees in Electrical Engineering and Computer Science from Ulsan National Institute of Science and Technology, South Korea in 2016. He had worked as a research assistant at BICDL Laboratory, South Korea for 6 months before joining KAUST. He obtained M.S. degree in Events Presented Events Nov 24 - Nov 30, 2024 Cost-effective Large-area Digital Circuits via Adhesive Lithography Zhanibek Bizak, Ph.D. Student, Electrical and Computer Engineering Nov 25, 10:00 - 11:00 B3, R5, R5220 A silicon-based semiconductor has had revolutionary impact in all sectors of our lives. With approaching physical limits of further downscaling, there is a growing need for alternative materials and architectures to continue the sustain technological progress of digital circuits. The emerging technologies should tackle various challenges, including fabrication process complexity reduction, compatibility with other technologies, large-area scalability, application focused design flexibility. These challenges were addressed, and alternative solutions been provided in this dissertation work
Cost-effective Large-area Digital Circuits via Adhesive Lithography Zhanibek Bizak, Ph.D. Student, Electrical and Computer Engineering Nov 25, 10:00 - 11:00 B3, R5, R5220 A silicon-based semiconductor has had revolutionary impact in all sectors of our lives. With approaching physical limits of further downscaling, there is a growing need for alternative materials and architectures to continue the sustain technological progress of digital circuits. The emerging technologies should tackle various challenges, including fabrication process complexity reduction, compatibility with other technologies, large-area scalability, application focused design flexibility. These challenges were addressed, and alternative solutions been provided in this dissertation work
Related Sites Electrical and Computer Engineering (ECE) Sensors (Sensors) Integrated Microwaves Packaging Antennas and Circuits Technology (IMPACTS) Related Content Events 1
