About Yating Wan Yating Wan Assistant Professor, Electrical and Computer Engineering photonics Optical Wireless Communication on-chip light sources heterogeneous integration CMOS-compatible photonics semiconductor optoelectronics integrated photonics Dr. Yating Wan, an assistant professor of electrical and computer engineering at KAUST, excels in silicon photonics, with special emphasis on the integration of on-chip light sources. Projects Related Projects 2018 Heterogeneously Integration Fri, Jun 1 2018 - Wed, Oct 1 2025 QD laser heterogenouse integration Heterogeneous integration bonds unpatterned III-V thin films to silicon wafers at the early- to mid-stages with a coarse alignment, and then define devices lithographically on the full wafer scale. 2017 Microcavity devices Sat, Jul 1 2017 - Wed, Oct 1 2025 laser microstructure By light confinement in small volumes with resonant recirculation, microcavity lasers promise to complement the rise of Si photonics by populating these chips with extreme small size. Monolithic integration with QD active medium Sat, Jul 1 2017 - Wed, Oct 1 2025 QD laser monolithic integration Direct epitaxial integration of III-V optoelectronic devices on Si offers a substantial manufacturing cost and scalability advantage over heterogeneous integration via wafer bonding.
Heterogeneously Integration Fri, Jun 1 2018 - Wed, Oct 1 2025 QD laser heterogenouse integration Heterogeneous integration bonds unpatterned III-V thin films to silicon wafers at the early- to mid-stages with a coarse alignment, and then define devices lithographically on the full wafer scale.
Microcavity devices Sat, Jul 1 2017 - Wed, Oct 1 2025 laser microstructure By light confinement in small volumes with resonant recirculation, microcavity lasers promise to complement the rise of Si photonics by populating these chips with extreme small size.
Monolithic integration with QD active medium Sat, Jul 1 2017 - Wed, Oct 1 2025 QD laser monolithic integration Direct epitaxial integration of III-V optoelectronic devices on Si offers a substantial manufacturing cost and scalability advantage over heterogeneous integration via wafer bonding.
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