Abstract:
This talk will examine the transformative advancements and challenges shaping the future of heterogeneous integration (HI) over the next ten years. By exploring both prior innovations and state-of-the-art technologies, the presentation will highlight key issues in semiconductor manufacturing, thermal management, and advanced packaging. With a focus on current industry challenges such as global chip shortages and strategic initiatives like the US CHIP Act, the talk will emphasize the need for robust technological roadmaps to support AI, HPC, and other next-generation applications.
A central theme will be the future of heterogeneous integration through chiplet technology, which holds the promise of revolutionary advancements but faces significant challenges. The discussion will delve into the critical trade-offs related to package substrates, silicon die size, power density, thermal resistance, package coplanarity and warpage, and ball-grid array assembly. Addressing these factors is essential for developing thermal and mechanical solutions that support ongoing technological progress.
Looking forward to 2033, the shift toward larger die sizes may necessitate the adoption of a System on Wafer (SoW) approach to overcome the constraints posed by chiplet-based integration. Achieving this vision will require a strong collaboration between industry and academia to drive advancements in heterogeneous integration, unlocking the full potential of this critical technology.
Brief Biography:
Dr. Gamal Refai-Ahmed is a highly respected technical executive and globally recognized leader in thermal management, silicon architecture, and advanced packaging technologies. With over three decades of experience in the semiconductor industry, Dr. Refai-Ahmed has made substantial contributions to high-performance computing (HPC), artificial intelligence (AI), and microelectromechanical systems (MEMS). He has held senior technical positions at leading companies, including AMD, GE, Cisco, and Nortel, shaping innovations across various industries.
In his current role as Senior Fellow and Chief Architect at AMD, Dr. Refai-Ahmed has been pivotal in developing advanced silicon power and thermo-mechanical architectures. His expertise has enhanced hardware thermal management and packaging technologies, particularly for AMD products, impacting sectors such as telecommunications, data centers, and automotive. His visionary leadership has also helped create ecosystems that integrate HPC, network interface cards (NIC), AI, and machine learning (ML) within modern data centers.
Dr. Refai-Ahmed’s groundbreaking work has earned him numerous accolades, including election to the U.S. National Academy of Engineering (NAE) and Fellowships with IEEE, ASME, and the Canadian Academy of Engineering (CAE). He has been honored with prestigious awards, such as the Presidential Medal from Binghamton University for his leadership in innovation and the IEEE Canada R.H. Tanner Industrial Leadership Silver Medal Award. In 2024, he recives the Waterloo Engineering Alumni Achievement Medal for Professional Achievement.
With over 160 U.S. and international patents and more than 130 publications in leading IEEE, ASME, and AIAA journals and conferences, Dr. Refai-Ahmed is a leading figure in the fields of thermal management and advanced packaging. His Ph.D. in Mechanical Engineering from the University of Waterloo, Canada, laid the foundation for his extensive contributions to the advancement of electronics packaging technologies.
Dr. Refai-Ahmed’s career is defined by a commitment to innovation and excellence in engineering. His work has had a lasting global impact on semiconductor technology, and his ongoing involvement in professional societies such as IEEE and ASME continues to shape the future of high-performance computing and advanced packaging. His contributions have inspired the next generation of engineers and researchers, cementing his legacy as a transformative figure in the industry.
